Slashleaks has published a list of some of the specifications of the upcoming Huawei Mate 40 smartphone.
Some of the Huawei Mate 40 specifications
The screenshot reveals that the device has an octa-core HiSilicon Kirin 9000 SoC, with 8 to 12 GB of RAM and 128, 256 or 512 GB of storage.
Also mentioned are a non-removable battery, a gravity sensor, a proximity sensor, a light sensor, an acceleration sensor, an electronic compass, a quick charge support, a gyroscope and a fingerprint sensor located below the screen surface.
The smartphone must have a top camera. At least it should not be inferior to the Huawei P40 camera, but its specifications have not been mentioned yet.
The presentation of the Huawei Mate 40 will take place in September of this year. The information was personally confirmed by Huawei Consumer Business Group CEO Yu Chengdong (Richard Yu).
The Huawei Mate 40 will end the cycle of Kirin flagships
Now that the second season of the flagship smartphone has officially started with the arrival of the Samsung Galaxy Note 20 family, Huawei is also preparing to announce the flagship of the H2 in the form of the Huawei Mate 40 series. The first leaks and reports about the upcoming flagship appear already. First of all, it will be another powerful factory with a camera with the excellent performance of the latest Kirin chipset. Recently, Richard Yu, President of Huawei Consumer Business Group, revealed to participants that the Huawei Mate 40 will pack a HiSilicon Kirin chipset. Also recently, we can assume that the Mate 40 with the Kirin 9000 will end the cycle of flagships with a Kirin engine.
According to executive, HiSilicon will no longer be able to manufacture the Kirin chipset after September 15, 2020. Now production is in a hurry to secure the largest possible quantity of Kirin 9000 units before this deadlock. The end of the Kirin chipset comes as a result of conventional chipmakers not being able to use US-developed technology to make chips for Huawei. This includes the TSMC behind the manufacture of HiSilicon chips. TSMC currently produces all HiSilicon high-tech brands for Huawei flagship devices. Like networking processors for fifth generation network support.
Huawei is trying to find a viable solution to replace the TSMC. This pursuit led to a collaboration with the Chinese SMIC that brought the HiSilicon Kirin 710A chip. Unfortunately, SMIC is far from being able to produce cutting-edge 7nm or 5nm chips. Even modern mid-range phones already have 12nm or even 7nm manufacturing processes. After September 15, Huawei will not have a viable internal solution to compete in the smartphone market.